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Solder Paste PrintingThe solder paste printing process is one of the most important and difficult steps in the SMT assembly process. Random defects can occur due to the material
and equipment variables involved. These variables together with the continuing miniaturization
of components can create a wide variety of solder defects which result in costly rework if controls are not implemented
and monitored. Over 65% of defects can be attributed to solder paste printing, therefore the selection of the correct materials
and equipment is essential if high yields are to be achieved.
    
Solder Paste Laser
Cut Stencils Stencil Printer
Solder Paste Stencil Cleaner
Measurement
Component Placement
SMT component placement machines need
to reliably and accurately pick and place all types of components from all presentation formats (tape, stick and tray)
at the lowest possible overall cost per placement at whatever rate (cph) the customer desires. Consideration should be
given to the purchase price, cost of operation, machine flexibility, product changeover time, ease and speed of off-line program
generation, future upgradeabaility of platform, actual cph (not rated), expected life of the machine, etc. Additionally ensuring
set-up and relenishemnt of the correct components during assembly will save costly rework, maximize profit and avoid defects
reaching customers. Call us for a copy of the SMT component placement comparison matrx booklet.
    
High speed SMT Flexible SMT placement Off-line setup 20 nozzle high
speed 01005 Certified
placement
and verification placement head
Reflow
Soldering
SMT reflow soldering is accomplished primarily using forced convection or vapor phase
technologies. Advances in component packaging and materials, together with environmental concens are placing constant
demands for better thermal performance while also manufacturing faster and more economically. This means less downtime and
better reliability if these demands are to be met.
For companies using nitrogen in their process an on-site generator
delivers nitrogen at substantially lower cost than bulk liquid delivered.
  
Forced Convection reflow soldering Vapor Phase
reflow Nitrogen Generators
Soldering
Through Hole Assembly
Through hole technology continues to remain popular many years after it had been projected to become obsolete.
In fact a new generation of products, Selective Soldering systems, have been introduced into the market to reduce
the cost and inconsistency of hand soldering. Wave soldering remains the soldering method of choice for large volume
production of primarily through hole dominant assemblies.      
Radial & Axial
Bar Solder, Flux and Pallets and Fixtures
Wave and Selective Soldering
Lead Forming
Solder Wire
Inspection and Test
Packaging more and smaller devices onto ever decreasing real estate without suffering yield issues is the challenge
facing todays electronics assemblers. Various inspection tools are required to monitor each step in the assembly process
in order to deliver the highest possible yields, keeping costly rework to a minimum. Some of the methods and strategies
used are:
1) SPI (solder paste inspection) measures and monitors the volume of paste deposited onto the PCB
2) AOI
(automated optical inspection) for pre and post reflow inspection.
3) X-Ray inspection are necessary for hidden
solder connections such as BGA, QFN and checking for voids.
4) Flying Probe testing provides full testing coverage for
prototypes, low volume builds and first article verification without expensive custom fixtures.
5) Traditional optical
inspection aids are still widely used for both inspection and rework.
     
AOI and SPI Inspection
X-Ray Inspection
Optical Flying Probe testing
Inspection
Board transport, marking, separation,
coating and rework.
PCB and material hadling solutions including loader/unloaders, FIFO and LIFO
buffers, inspetion/assembly stations, shuttlegates, inverters, wave soldering loader/unloader, etc. ensure product flow through
each of the assembly processes.
Laser marking and label applicators for identification, traceability, rework, tracking
and marketing.
Manual, semi-automatic and automatic PCB separation systems for batch or in-line singulation.
Precision
spray coating of conformal coating and flux on PCB's, photoresist on semiconductors, fuel cell and various medical applications.
    
PCB Handling Laser Marking
PCB Separation
PCB Routing Coating Systems
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